Investigations on electromagnetic noises and interactions in electronic architectures : a tutorial case on a mobile system

Electromagnetic interactions become critic in embedded and smart electronic structures. The increase of electronic performances confined in a finite volume or support for mobile applications defines new electromagnetic environment and compatibility configurations (EMC). With canonical demonstrators developed for tutorials and EMC experiences, this paper present basic principles and experimental techniques to investigate and control these severe interferences. Some issues are reviewed to present actual and future scientific challenges for EMC at electronic circuit level

Applications of Integrated Near-field Antennas for Diagnosis of Electromagnetic Noises in Hybrid Electronic Architectures

In modern electronic devices, increase of switching performances and integration design with new techniques and material make the compliances with the internal and external radiated behavior more and more critical. This paper present a synthetic state of challenging works to deal with this constraint. Different techniques and prototypes have been studied and developed to integrate electromagnetic sensors and probes in hybrid technology circuits. A good realistic and real-time evaluation of electromagnetic activity of these circuits should help for EMC background and designing, but also should be convenient to optimize the electromagnetic behavior during the real activity of the electronics

Real-cases of electromagnetic immunity and reliability in embedded electronics architectures

This papers concerns works about electromagnetic immunity and reliability investigations on electronics devices, combined with different physical impacts as temperature

Effects of thermal aggressions on susceptibility responses and immunity figures of PWM patterns

In embedded and on-board electronics context, environmental temperature has an influence on the real electromagnetic compliance and EMC figures. We present studies and results of temperature impacts on susceptibility and immunity figures. Specific dual thermal-electromagnetic set-up have been developed for this. A campaign of EMC-Thermal-parametric measurements has been realized on PWM patterns of digital PCBs dedicated for electronic drive and command. Temperature dependent susceptibility behaviors are presented, in the range of 3GHz for harmonic aggressions, that leads to discuss of new cases of EM sensitivity, couplings and immunity approach on electronic devices

The rise of electromagnetic pollution and interactions in mobile and transport applications using new electronic chips and energy devices

International audienceThe development of wireless electronics, digital systems and mechatronics sciences leads to performant applications in our environment: smart systems, mobile systems, all electrical vehicles, wireless connectivity, aerial and humanoids robots, etc. Theses structures merged because of main progress in material and semi-conductors for electronics, both in digital and power components, and techniques for integration so to keep performances and reliable activity for user’s convenience. But the use of new electronic and electromagnetic technics has scientific drawbacks, that are mainly the rise of electromagnetic interferences and pollutions,and the endless rise of temperature that need to be more and more cooled. They impact on scientific and industrial working policies, because of changing the real conditions of the officialstate-of-the-art regulatory rules, both for EMC Electromagnetic Compatibility) and Reliabity Standards.This poster will remind basic principles and experimental techniques to investigate and control these severe interferences, to comply with these new problematics:The shift of the range of frequency of conducted and radiated emissions of power and digital electronics, that is denoted the Electromagnetic noises or pollution. The rising of Electromagnetic couplings an interactions, from electronics Chips to Embedded system. It’s called Intra-EMC (couplings inside the system), and Immunity (between complete systems, mobile phone vs robot for example)The impact of real multiphysics conditions (temperature, new materials, Electrostatic Discharges) on the ageing and the real time conditions of Susceptibility(Defaults) andReliability of a system. For example, electronics boards and processors in automotive with high-temperature environment due to the thermal or electrical motor. Some issues are reviewed to present actual and future scientific challenges for EMC, from electronic circuit level to complete integrated system as mobile phone and robots

New susceptibility and immunity figures of PWM patterns and circuits with temperature impacts

This paper deals with susceptibility studies combined with temperature on electronic devices used to control power and transmissions. Specific dual thermal-electromagnetic test set-up developed for this are presented. Temperature dependant susceptibility and sensitivity of the PWM parameters on dedicated digital PCB are compared and analyzed

Bruit électromagnétique et susceptibilité des architectures électroniques en présence d'environnement thermique agressif

Ce papier présente une synthèse d'études, principalement expérimentales, menées au LabCEEM-IUT de Tarbes autour des interactions thermique-électromagnétiques dans des architectures électroniques sensibles. Une première partie présente les développements de méthodes et de bancs associés visant à qualifier le comportement CEM : émission, immunité, de cartes électroniques en fonction de la température locale ou ambiante. Des résultats et leurs analyses sur des démonstrateurs électroniques reproduisant des commandes de type numérique et modulables (PWM) sont présentés. Cette synthèse démontre quelques conclusions importantes quant à l'origine et les conséquences de la modification des performances CEM dues à la température

Nouvelles problématiques EMC/EMI liées à l'intégration embarquée des architectures de puissance: aspects des émissions large-bande, des couplages champ proche et des impacts de la température

Depuis plusieurs années maintenant, les développements des architectures d'électronique de puissance pour la génération, la conversion et le contrôle de l'énergie électrique sont tournées vers des applications mécatroniques et embarquées comme les avions, les véhicules électriques ou hybrides, la robotique, la domotique, les implants corporels humains…. Ces nouvelles structures bénéficient des avancées dans les technologies des composants semi conducteur et de leurs packagings, permettant des techniques d'intégration et de réduction des volumes pour des performances de conversion électriques et de rendement équivalentes voire supérieures. Dans les convertisseurs de puissance utilisés dans les ensembles mécatroniques, l'augmentation de la fréquence et la réduction des temps de commutation ont permis de réduire considérablement la masse et le volume des éléments de filtrage et de refroidissement. Mais ces stratégies ont également induites et favorisées des problèmes complexes comme des difficultés d'extraction de chaleur ou de nouvelles problématiques d'interactions et de compatibilité électromagnétique (CEM), apparues lors du développement et de la mise en œuvre des ces applications. Nous présentons un état de l'art, non exhaustif, des travaux de recherche et développement menées ces dernières années autour de trois de ces nouveaux aspects CEM : La modification et l'élargissement en bande de fréquence des émissions conduites et rayonnées des convertisseurs de puissance l'augmentation des interactions et risques de couplages en champ proche E ou H entre les éléments électroniques des structures de puissance l'impact non négligeable de la température interne et externe, inhérente au fonctionnement nominal des systèmes, sur les performances CEM, émission et immunité, et leurs dégradations en temps réel ou sur la durée de vie du système électronique. Nous montrons comment ces aspects ont entrainés de nouvelles approches de caractérisation, de modélisation et de simulation orientées CEM, et modifient fortement le spectre d'analyses théoriques et les méthodes d'investigations des études CEM actuelles et a venir

The rise of electromagnetic pollution and interactions in mobile and transport applications using new electronic chips and energy devices

The development of wireless electronics, digital systems and mechatronics sciences leads to performant applications in our environment: smart systems, mobile systems, all electrical vehicles, wireless connectivity, aerial and humanoids robots, etc. Theses structures merged because of main progress in material and semi-conductors for electronics, both in digital and power components, and techniques for integration so to keep performances and reliable activity for user’s convenience. But the use of new electronic and electromagnetic technics has scientific drawbacks, that are mainly the rise of electromagnetic interferences and pollutions,and the endless rise of temperature that need to be more and more cooled. They impact on scientific and industrial working policies, because of changing the real conditions of the official state-of-the-art regulatory rules, both for EMC Electromagnetic Compatibility) and Reliabity Standards. This poster will remind basic principles and experimental techniques to investigate and control these severe interferences, to comply with these new problematics: The shift of the range of frequency of conducted and radiated emissions of power and digital electronics, that is denoted the Electromagnetic noises or pollution. The rising of Electromagnetic couplings an interactions, from electronics Chips to Embedded system. It’s called Intra-EMC (couplings inside the system), and Immunity (between complete systems, mobile phone vs robot for example) The impact of real multiphysics conditions (temperature, new materials, Electrostatic Discharges) on the ageing and the real time conditions of Susceptibility(Defaults) and Reliability of a system. For example, electronics boards and processors in automotive with high-temperature environment due to the thermal or electrical motor. Some issues are reviewed to present actual and future scientific challenges for EMC, from electronic circuit level to complete integrated system as mobile phone and robots

Mechanical stress induced by electromagnetic forces on wire bonds of high power modules

This paper concerns the analytical determination and experimental characterization of electromagnetic forces exerted on high power IGBT wire bonds